LAPPING SOLUTION COMPOSITION

PROBLEM TO BE SOLVED: To obtain the subject composition for silicon or the like, excellent in compounding stability of abrasive grains and good in fluidity by using specific glycol ether and abrasive grains. SOLUTION: This composition comprises 1 to 70wt.% of a glycol ether shown by the formula R O(...

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Bibliographic Details
Main Authors KAWAGUCHI KOJI, NAGAI KUNIO
Format Patent
LanguageEnglish
Published 04.08.1998
Edition6
Subjects
ADHESIVES
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To obtain the subject composition for silicon or the like, excellent in compounding stability of abrasive grains and good in fluidity by using specific glycol ether and abrasive grains. SOLUTION: This composition comprises 1 to 70wt.% of a glycol ether shown by the formula R O(Cn H2n O)m R (R is a 1-18C alkyl, alkenyl, alkylphenyl or phenyl; R is a 1-4C alkyl; (m) is 1 to 10; and (n) is 2-4), and (B) 30 to 70wt.% of abrasive grains. It is recommended that the component A has a solubility parameter of 7.5 to 9.0, e.g. ethylene glycol dimethyl ether, and the component B has an average grain size of 2 to 20μm, e.g. silicon carbide or diamond.
Bibliography:Application Number: JP19970020090