MOUNTING DEVICE FOR CONDUCTIVE BALL

• Main Author: ARIKADO KAZUO
• Format: Patent
• Language: English
• Published: 31.07.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; COMBINED OPERATIONS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a mounting device for a conductive ball in which conductive balls are surely vacuum-sucked one by one by an suction hole and the ball is mounted on a work with high density, when the conductive ball is vacuum-sucked by the suction hole on the lower surface of a sucti...