MOUNTING DEVICE FOR CONDUCTIVE BALL

• Main Author: ARIKADO KAZUO
• Format: Patent
• Language: English
• Published: 31.07.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; COMBINED OPERATIONS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a mounting device for a conductive ball in which conductive balls are surely vacuum-sucked one by one by an suction hole and the ball is mounted on a work with high density, when the conductive ball is vacuum-sucked by the suction hole on the lower surface of a suction head, to mount it on pad of a work. SOLUTION: A vertical hole 29 is formed on the lower surface of a suction head 30. The cross section of a suction hole 31 connected to the lower part of the vertical direction 29 has a form provided with a gentle angle surface (a) gently widening toward the end and a sharp angle surface (b). And an opening diameter L3 of the hole 31 is made small, and the holes 31 are formed with narrow pitches, and the hole 31 is so made as not to vacuum-suck excessive conductive ball 14, and suction characteristic of the conductive ball 14 from the suction hole 31 when mounting on a pad 26 of a work 25 is made superior.