CREEP LIFETIME EVALUATING METHOD FOR HIGH TEMPERATURE APPARATUS

PROBLEM TO BE SOLVED: To provide a creep lifetime evaluating method for a high temperature apparatus which can obtain reliable data with a small number of samples in a short test time. SOLUTION: A plurality of thermocouples 4 are mounted on a parallel portion of a test piece 3 in an axially spaced-a...

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Bibliographic Details
Main Author KOYAMA TERUO
Format Patent
LanguageEnglish
Published 23.01.1998
Edition6
Subjects
BLASTING
HEATING
LIGHTING
MEASURING
MECHANICAL ENGINEERING
METHODS OF STEAM GENERATION
PHYSICS
STEAM BOILERS
STEAM GENERATION
TESTING
TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES
TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide a creep lifetime evaluating method for a high temperature apparatus which can obtain reliable data with a small number of samples in a short test time. SOLUTION: A plurality of thermocouples 4 are mounted on a parallel portion of a test piece 3 in an axially spaced-apart manner. The temperature distribution on the entire parallel portion of the test piece 3 is estimated from temperatures monitored by these thermocouples 4. Upon completion of a rupture test, a creep damage rate on at least one portion of the parallel portion with an exception of the ruptured portion is obtained by observing a change in micro structure thereof and a change in hardness thereof. The rupture time is estimated from the creep damage rate and the creep test time, and the relationship between the rupture time and the operation temperature is obtained from the rupture portion and the change in the microstructure and hardness.
Bibliography:Application Number: JP19960168927