PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board, in which marring and crushing are difficult to generate in a solder layer on a pad even when a plurality of the printed wiring boards are superposed and placed. SOLUTION: In the printed wiring 1, a solder resist 5 is provided on the board 2 wi...

Full description

Saved in:
Bibliographic Details
Main Author SATAKE HIROAKI
Format Patent
LanguageEnglish
Published 21.07.1998
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a printed wiring board, in which marring and crushing are difficult to generate in a solder layer on a pad even when a plurality of the printed wiring boards are superposed and placed. SOLUTION: In the printed wiring 1, a solder resist 5 is provided on the board 2 with a pad row 3 consisting of a plurality of pads 7, 8, and the pad row 3 is exposed from the opening section 6 of the solder resist 5. The pad row 3 is composed of the normal pads 7, which are related to the wiring 1 and to which solder precoating layers 9 are formed, and a dummy pad 8 not related to the wiring. The height T2 of the dummy pad 8 is made relatively higher than that T1 of the normal pad 7, to which the solder precoating layer 9 is added.
Bibliography:Application Number: JP19960343780