SEMICONDUCTOR DEVICE AND JUNCTION STRUCTURE OF SEMICONDUCTOR DEVICE AND SUBSTRATE

PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein a short circuit generation of when it is mounted can be prevented with certainty, and productivity and mounting reliability can be improved, and to provide a junction structure to a substrate. SOLUTION: A wall part 31 of insulating mat...

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Bibliographic Details
Main Author YAJIMA KEI
Format Patent
LanguageEnglish
Published 21.07.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein a short circuit generation of when it is mounted can be prevented with certainty, and productivity and mounting reliability can be improved, and to provide a junction structure to a substrate. SOLUTION: A wall part 31 of insulating material, which is lower than the height of solder balls 30, is formed between the adjacent solder balls 30 on the backside of the substrate 26 on the side of a semiconductor device 24. When the solder balls 30 are melted at the time of mounting the substrate 26, a ball grid array sinks in corresponding to the amount of the molten solder balls, and the substrate 26 is fixed to a substrate 25 in a state, wherein the tip of the wall part 31 is brought into contact with the substrate 25.
Bibliography:Application Number: JP19960341920