APPARATUS AND METHOD FOR AUTOMATIC SUPPLY OF THINNER FOR SEMICONDUCTOR MANUFACTURE

PROBLEM TO BE SOLVED: To provide an apparatus and a method, for the automatic supply of a thinner for semiconductor manufacture, in which the productivity of a semiconductor device can be enhanced by a method wherein air bubbles do not flow into a jet nozzle and the thinner is jetted so as to be alw...

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Bibliographic Details
Main Authors SAI KEISO, U ZAIEI, SAI YURETSU
Format Patent
LanguageEnglish
Published 21.07.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
THEIR RELEVANT APPARATUS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide an apparatus and a method, for the automatic supply of a thinner for semiconductor manufacture, in which the productivity of a semiconductor device can be enhanced by a method wherein air bubbles do not flow into a jet nozzle and the thinner is jetted so as to be always constant. SOLUTION: An automatic thinner supply apparatus is formed in such a way that auxiliary supply tanks 14 are connected to a main supply tank 11 at the thinner supply apparatus provided with a jet nozzle 4 used to rinse a wafer 6 and that a multibranch pipe 16 is connected to the auxiliary supply tanks 14. A thinner inside the main supply tank 11 is made to flow into the auxiliary supply tanks 14, the thinner inside the auxiliary supply tanks 14 is made to flow into the multibranch pipe 16 to which the jet nozzle 4 is connected, and the thinner is jetted continuously by the jet nozzle 4.
Bibliography:Application Number: JP19970298363