POLISHING APPARATUS

PROBLEM TO BE SOLVED: To improve the productivity of wafers, by performing continually a process for sucking a plurality of wafers stored in a cassette by polishing heads for polishing and cleaning the wafers, and a process for storing the wafers again in the cassette. SOLUTION: Delivering a plurali...

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Bibliographic Details
Main Author SEKIDA SABURO
Format Patent
LanguageEnglish
Published 26.06.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve the productivity of wafers, by performing continually a process for sucking a plurality of wafers stored in a cassette by polishing heads for polishing and cleaning the wafers, and a process for storing the wafers again in the cassette. SOLUTION: Delivering a plurality of wafers 1 stored in a cassette 2 from a loading portion 100 to a carrying portion 200, the wafers 1 are polished while a polishing liquid is fed to the clearances between polishing heads 302-305 of an index portion 300 for polishing simultaneously the plurality of wafers 1 and the polishing cloth of a surface plate 400. Then, wafer 3 obtained after the wafers 1 are cleaned in a cleaning portion 500 are so carried to a cassette 4 by an unloading portion 600 utilizing a wafer flow plate 602 as not to be damaged and polluted.
Bibliography:Application Number: JP19960332115