METHOD AND APPARATUS FOR MOUNTING OF ELECTRONIC COMPONENT

• Main Authors: KURATA HIROAKI, MORI TETSUYA
• Format: Patent
• Language: English
• Published: 19.06.1998
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMBINED OPERATIONS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING; UNIVERSAL MACHINE TOOLS

PROBLEM TO BE SOLVED: To provide an electronic-component mounting apparatus by which components can be replenished without stopping a mounting operation, even when the components becomes out of stock during their mounting operation. SOLUTION: In an electronic-component mounting apparatus, a plurality of electronic-component feed parts are provided. The electronic-component mounting apparatus is provided with a data storage part 1 which holds a sequence program for a mounting operation, with a mounting part 4, with a component control part 2 which monitors the number of residual components, which detects whether the components are out of stock and which issues a signal that the components are out of stock and with a skip-mounting control part 3 which takes out the sequence program one step by one step from the data storage part 1 so as to be transmitted to the mounting part 4, which receives the signal that the components are out of stock, which skips the step of electronic-component feed parts having the out-of-stock components, which confirms the completion of the replenishment of the out-of-stock components, and which transmits the skipped step to the mounting part 3.