ELECTROSTATIC METAL WIRE VAPOR DEPOSITING METHOD AND DEVICE THEREFOR

• Main Author: TATAH ABDELKRIM
• Format: Patent
• Language: English
• Published: 09.06.1998
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To facilitate restoration of an electrode by enabling the precise vapor deposition of metallic ions. SOLUTION: This method for restoring or thickening metal wire on a secondary substrate 23 is the one in which a primary substrate 21 having metallic coating 22 on the surface is arranged at intervals with a secondary substrate 23 in such a manner that the metal wire on the secondary substrate 23 are made adjacent to the surface of the primary substrate 21 having the metallic coating 22, for releasing the ions of the metallic coating 22, the metallic coating 22 are abrated, the ions are oriented to the metal wire, and for allowing the ions to adhere to the metallic coating by static electricity, electrolysis is applied over the primary substrate 21 and the metal wire.