SIDE-USE ELECTRONIC COMPONENT PROVIDED WITH LOWER ELECTRODE

• Main Author: ISHII HIROHIKO
• Format: Patent
• Language: English
• Published: 02.06.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined with a thin solder layer, and enhanced in mounting reliability, by a method wherein an edge face pattern is formed on the plane inner side of a...