SIDE-USE ELECTRONIC COMPONENT PROVIDED WITH LOWER ELECTRODE

• Main Author: ISHII HIROHIKO
• Format: Patent
• Language: English
• Published: 02.06.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined with a thin solder layer, and enhanced in mounting reliability, by a method wherein an edge face pattern is formed on the plane inner side of a through-hole provided to an aggregate board to serve as a lower electrode, which comes into close contact with a corresponding wiring pattern keeping in parallel with it. SOLUTION: An electronic part is equipped with a board 1, an upper electrode 2, an electronic device 3 such as an LED or the like die-bonded to the upper electrode 2, and a bonding wire 4 serving as a connecting means. An edge face pattern 5 formed on the plane inner side of an elliptical through-hole, a protective sealing resin 7, and if necessary, a lower electrode 10 are provided. A cut line is provided to separate an aggregate board and a finished electronic component. Furthermore, a corresponding circuit board 13 which is indicated by an imaginary line and where the electronic part is mounted in a surface- mounting manner is equipped with a wiring pattern 8 formed on its surface and a soldering material 9 processed into a thin layer through a reflow process.