SIDE-USE ELECTRONIC COMPONENT PROVIDED WITH LOWER ELECTRODE
PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined with a thin solder layer, and enhanced in mounting reliability, by a method wherein an edge face pattern is formed on the plane inner side of a...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
02.06.1998
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined with a thin solder layer, and enhanced in mounting reliability, by a method wherein an edge face pattern is formed on the plane inner side of a through-hole provided to an aggregate board to serve as a lower electrode, which comes into close contact with a corresponding wiring pattern keeping in parallel with it. SOLUTION: An electronic part is equipped with a board 1, an upper electrode 2, an electronic device 3 such as an LED or the like die-bonded to the upper electrode 2, and a bonding wire 4 serving as a connecting means. An edge face pattern 5 formed on the plane inner side of an elliptical through-hole, a protective sealing resin 7, and if necessary, a lower electrode 10 are provided. A cut line is provided to separate an aggregate board and a finished electronic component. Furthermore, a corresponding circuit board 13 which is indicated by an imaginary line and where the electronic part is mounted in a surface- mounting manner is equipped with a wiring pattern 8 formed on its surface and a soldering material 9 processed into a thin layer through a reflow process. |
---|---|
AbstractList | PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined with a thin solder layer, and enhanced in mounting reliability, by a method wherein an edge face pattern is formed on the plane inner side of a through-hole provided to an aggregate board to serve as a lower electrode, which comes into close contact with a corresponding wiring pattern keeping in parallel with it. SOLUTION: An electronic part is equipped with a board 1, an upper electrode 2, an electronic device 3 such as an LED or the like die-bonded to the upper electrode 2, and a bonding wire 4 serving as a connecting means. An edge face pattern 5 formed on the plane inner side of an elliptical through-hole, a protective sealing resin 7, and if necessary, a lower electrode 10 are provided. A cut line is provided to separate an aggregate board and a finished electronic component. Furthermore, a corresponding circuit board 13 which is indicated by an imaginary line and where the electronic part is mounted in a surface- mounting manner is equipped with a wiring pattern 8 formed on its surface and a soldering material 9 processed into a thin layer through a reflow process. |
Author | ISHII HIROHIKO |
Author_xml | – fullname: ISHII HIROHIKO |
BookMark | eNrjYmDJy89L5WSwDvZ0cdUNDXZVcPVxdQ4J8vfzdFZw9vcN8Pdz9QtRCAjyDwMqcFEI9wzxUPDxD3cNgil0ceVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GBoamBobGFo7GxKgBAP9zK1s |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
Edition | 6 |
ExternalDocumentID | JPH10150138A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JPH10150138A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 11:23:45 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JPH10150138A3 |
Notes | Application Number: JP19960318502 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980602&DB=EPODOC&CC=JP&NR=H10150138A |
ParticipantIDs | epo_espacenet_JPH10150138A |
PublicationCentury | 1900 |
PublicationDate | 19980602 |
PublicationDateYYYYMMDD | 1998-06-02 |
PublicationDate_xml | – month: 06 year: 1998 text: 19980602 day: 02 |
PublicationDecade | 1990 |
PublicationYear | 1998 |
RelatedCompanies | CITIZEN ELECTRON CO LTD |
RelatedCompanies_xml | – name: CITIZEN ELECTRON CO LTD |
Score | 2.4889355 |
Snippet | PROBLEM TO BE SOLVED: To enable an electronic component to be enhanced in solder wettability when it is mounted in a surface-mounting manner, firmly joined... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | SIDE-USE ELECTRONIC COMPONENT PROVIDED WITH LOWER ELECTRODE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980602&DB=EPODOC&locale=&CC=JP&NR=H10150138A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp6LzgwrSt2L6sa5FirgkoytrU7ru422sawv60A1X8d83qavzRd9CchyXwOXyS-53AXjIdVEDPNWVZGnmitGxbMXu5gK4cvC8QNoyyQVR2A9Md2x4s86sAW81F6aqE_pZFUfkHrXk_l5W-_V6d4lFqtzKzWPyyrtWz_3YIXJa08WQiTSZ9BwaMsKwjLHjhXIQOa4qoL2qWy97sC-O0aLOPp30BCtl_Tuk9E_gIOTaivIUGlnRgiNc_7zWgkN_--DNm1vf25zB02hAqDIeUYkOKY4jFgywhJkfsoAGsRRGbMIFiDQdxK40ZFMa1YKEnsN9n8bYVbgV858pz71wZ7B-Ac1iVWSXINm5baUczGqdzDSQntnWIuEuhNSka-coRVfQ_ltP-7_Bazj-ZtuJlOQbaJbvH9ktD7dlclet0xftV33x |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1dS8MwFL3MKc43ncqcXxWkb8Vs3boWKeKSjHa2Tem6j7exri3oQzdcxb9vUlfni76F5HK5CdxcTpJzAnCfqkIDPFaVaKmlSqerG4rRSwVw5eB5gdrLKBVEYdfTrHFnOOvOKvBWcmEKndDPQhyRZ9SS53te7Nfr3SEWKd5Wbh6iV961ehqEJpHjki6GNNSWSd-kPiMMyxibQ1_2AtNqCWjfUvXnPdjvcUgodPbppC9YKevfJWVwDAc-95blJ1BJsjrUcPnzWh0O3e2FN29uc29zCo8jm1BlPKISdSgOA-bZWMLM9ZlHvVDyAzbhBkSa2qElOWxKg9KQ0DO4G9AQWwqPYv4z5fnQ3wWsnkM1W2VJAyQjNfSYg9l2N9E6SE0MfRHxFEKtqGekKEYX0PzbT_O_wVuoWaHrzB3be7mEo2_mnXiefAXV_P0juealN49uijX7AvYwgNw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SIDE-USE+ELECTRONIC+COMPONENT+PROVIDED+WITH+LOWER+ELECTRODE&rft.inventor=ISHII+HIROHIKO&rft.date=1998-06-02&rft.externalDBID=A&rft.externalDocID=JPH10150138A |