DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

• Main Author: ONO FUMINOBU
• Format: Patent
• Language: English
• Published: 02.06.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To join a semiconductor element to a package without deteriorating life characteristics of the semiconductor element. SOLUTION: When a package 1 is joined to a semiconductor element 2, under such a condition that low-melting-point solder material 3 is provided between the packa...