DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

• Main Author: ONO FUMINOBU
• Format: Patent
• Language: English
• Published: 02.06.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To join a semiconductor element to a package without deteriorating life characteristics of the semiconductor element. SOLUTION: When a package 1 is joined to a semiconductor element 2, under such a condition that low-melting-point solder material 3 is provided between the package and element, the element 2 is put in its temperature balanced state under actual operating temperature conditions. Under this condition, electrode pads 9 on pellets of the element 2 are compressed against electrode terminals 8 of a suction collet 5 electrically connected with an output side of a high-voltage pulse power supply 4, so that the pads are electrically connected with the terminals 8. Next, a high voltage pulse generated by the power supply 4 is applied to the pads 9 so that the solder material 3 melts, thereby realizing joint between the package 1 and element 2. Thereby the joint can be done under actual operating temperature conditions of the element 2, thermal stress to the element 2 can be suppressed, and life characteristics of the element can be improved.