VERY SMALL METALLIC BUMP

• Main Authors: FUCHIDA HIDETSUGU, SETOGUCHI KAZUHIRO
• Format: Patent
• Language: English
• Published: 26.05.1998
• Edition: 6
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; METALLURGY; PHYSICS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TESTING

PROBLEM TO BE SOLVED: To produce a metallic bump which has high hardness and affords a good electrical contact when this bump is used as a contact terminal. SOLUTION: The superfine particles obtd. by evaporating, for example, nickel, are transported together with gaseous helium as a carrier gas and are deposited on a silicon wafer from a nozzle of a microdiameter, by which the conical nickel bump of about 10 to 100μm in diameter of the base and about 24μm height at the aggregate of the superfine particle of several tens nanometer in particle size is formed.