VERY SMALL METALLIC BUMP

PROBLEM TO BE SOLVED: To produce a metallic bump which has high hardness and affords a good electrical contact when this bump is used as a contact terminal. SOLUTION: The superfine particles obtd. by evaporating, for example, nickel, are transported together with gaseous helium as a carrier gas and...

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Bibliographic Details
Main Authors FUCHIDA HIDETSUGU, SETOGUCHI KAZUHIRO
Format Patent
LanguageEnglish
Published 26.05.1998
Edition6
Subjects
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
METALLURGY
PHYSICS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TESTING
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Summary:PROBLEM TO BE SOLVED: To produce a metallic bump which has high hardness and affords a good electrical contact when this bump is used as a contact terminal. SOLUTION: The superfine particles obtd. by evaporating, for example, nickel, are transported together with gaseous helium as a carrier gas and are deposited on a silicon wafer from a nozzle of a microdiameter, by which the conical nickel bump of about 10 to 100μm in diameter of the base and about 24μm height at the aggregate of the superfine particle of several tens nanometer in particle size is formed.
Bibliography:Application Number: JP19960312831