FORMATION OF SIO2 FILM BY PLASMA CVD

PROBLEM TO BE SOLVED: To provide a method for forming an SiO2 insulating film according to plasma CVD, capable of achieving higher speed film deposition, higher film adhesion, and higher film hardness. SOLUTION: A magnetic field is applied in a plasma generating chamber 1 by a magnetic coil 2 arrang...

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Bibliographic Details
Main Authors TAMAMAKI HIROAKI, NOMURA MASAYA, SANO KEIICHIRO
Format Patent
LanguageEnglish
Published 22.05.1998
Edition6
Subjects
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