POLISHING PAD

PROBLEM TO BE SOLVED: To provide a polishing pad, in the case of polishing a semiconductor wafer, memory disk, etc., which can improve flatness of this polishing surface extend a usable time and reduce a cost required for polishing. SOLUTION: A polishing pad 1 is formed by a felt-shaped fiber sheet...

Full description

Saved in:
Bibliographic Details
Main Authors YASUDA TATSUSHI, UCHIDA MIKIO
Format Patent
LanguageEnglish
Published 19.05.1998
Edition6
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GENERAL PROCESSES OF COMPOUNDING
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
POLISHING
THEIR PREPARATION OR CHEMICAL WORKING-UP
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a polishing pad, in the case of polishing a semiconductor wafer, memory disk, etc., which can improve flatness of this polishing surface extend a usable time and reduce a cost required for polishing. SOLUTION: A polishing pad 1 is formed by a felt-shaped fiber sheet 3 carrying a fine porous elastomer 4 composed mainly of polyurethane. A constitutional fiber of this felt-shaped fiber sheet 3 is 6.0 to 20.0 denier and 30 to 100mm fiber length, and METSUKE weight of the sheet is 150 to 600g/cm . A difference between maximum/minimum heights of a polishing surface of the felt-shaped fiber sheet 3 is within 20μm, and for providing flatness within 20μm in Ra (ten point average height), flatness may be applied by a plane of the same width or more.
Bibliography:Application Number: JP19960285400