HEAT-DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE

• Main Author: TOYOSHIMA TSUTOMU
• Format: Patent
• Language: English
• Published: 06.05.1998
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a heat-dissipating structure, which does not give users an unpleasant feeling by uniformizing the temperature of the whole ceiling board. SOLUTION: This construction is constituted by putting a board 4 on which heat-generating parts, etc., fixed to heat-dissipating boards 2 are mounted, a power unit 5 which supplies power, etc., on a bottom plate 1, and covering the bottom board 1 with a box 6 whose underside is opened, so that the heat of the heat-generating parts 3 is dissipated from the heat-dissipating boards 2 into the box, and the heat of the heated air in the box 6 is dissipating from the ceiling board 6a of the box 6 and so on. In this case, a heat-insulating material 7 is stuck to the internal surface of the ceiling board 6a above the heat-generating parts 3. Accordingly, a local temperature rise of the top board 6a is prevented by reflecting radiant heat from the heat-generating parts 3, etc., irregularly effectively, and uniformizing the temperature of the whole ceiling top 6a is enabled.