WAFER BOTH SURFACES WASHING AND DRYING DEVICE

PROBLEM TO BE SOLVED: To wash and dry both surfaces of a wafer at a time. SOLUTION: A chuck device 21 furnishing rollers 30, 31, 32, and 33 rotating by holding the outer peripheral ends of a wafer W; a chuck switching device 22 to open and close the chuck device 21 to connect and disconnect the wafe...

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Bibliographic Details
Main Author SEKIDA SABURO
Format Patent
LanguageEnglish
Published 21.04.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To wash and dry both surfaces of a wafer at a time. SOLUTION: A chuck device 21 furnishing rollers 30, 31, 32, and 33 rotating by holding the outer peripheral ends of a wafer W; a chuck switching device 22 to open and close the chuck device 21 to connect and disconnect the wafer W to the rollers; a rotary brush device 23 provided movable forward and rearward in order to hold both surfaces of the wafer W; and a washing water and air injection device 24 which is provided movable forward and rearward to hold both surfaces of the wafer, and feeds a washing water on both surfaces of the wafer in the washing time, while feeding the air on both surfaces of the wafer after the washing; are provided. Since there is no contacting article on the both surfaces of the wafer W except for brushes 46 and 47, no dirt is attached on the washed surface, and the yield rate of the wafer is made higher.
Bibliography:Application Number: JP19960255762