CLEANING DEVICE

PROBLEM TO BE SOLVED: To provide a wafer cleaning device which is excellent in cleaning efficiency and profitability (floor area, cost). SOLUTION: Cleaning solution fed to a cleaning tank 107 is lessened in flow rate in an initial stage and increased in flow rate in a middle and a late stage. A lid...

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Main Authors TANAKA YUICHIRO, OKA HITOSHI, TSUTSUI YOSHITAKA, HIRABAYASHI HISAAKI, NOGUCHI YUJI, DAIROKU NORIYUKI, SAITO AKIO, ITO HARUO
Format Patent
LanguageEnglish
Published 08.04.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a wafer cleaning device which is excellent in cleaning efficiency and profitability (floor area, cost). SOLUTION: Cleaning solution fed to a cleaning tank 107 is lessened in flow rate in an initial stage and increased in flow rate in a middle and a late stage. A lid 102 is provided to close a buffer tank 101 tight. Cleaning solution fed to the cleaning tank 107 from the buffer tank 101 is controlled in flow rate by regulating the position of a control pipe 104 in a vertical direction. By this setup, the supply of cleaning solution to the cleaning tank 107 can be finished in a short time (15 seconds) without producing splashes, air bubbles, and vibrations in wafers.
Bibliography:Application Number: JP19950253074