FORMATION OF COATING FILM

PROBLEM TO BE SOLVED: To prevent flatness from being deteriorated in an interlayer insulating film and a flattening film for etching-back owing to the influence of a step and to prevent the line width of a pattern from being greatly varied in the formation of the line pattern. SOLUTION: A method is...

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Bibliographic Details
Main Author IKEDA RIKIO
Format Patent
LanguageEnglish
Published 04.04.1997
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To prevent flatness from being deteriorated in an interlayer insulating film and a flattening film for etching-back owing to the influence of a step and to prevent the line width of a pattern from being greatly varied in the formation of the line pattern. SOLUTION: A method is for forming a coating film 14 by applying coating liquid 13 to the surface of a substrate 11 having the step 12. Coating liquid 13 contains solvent whose value of surface tension is more than 35mN/m and less than the value of the surface tension of water. Thus, the flatness of the coating film 14 is improved and the line width variation of the pattern formed at the coating film 14 is reduced.
Bibliography:Application Number: JP19950248996