THERMAL TREATMENT DEVICE AND METHOD

PROBLEM TO BE SOLVED: To prevent a coating film on the surface of a wafer from varying in thickness throughout the surface of the wafer in a thermal treatment and solvent comprised in a coating film vaporized through a thermal treatment from leaking out of a thermal treatment device. SOLUTION: A the...

Full description

Saved in:
Bibliographic Details
Main Author IKEDA RIKIO
Format Patent
LanguageEnglish
Published 04.04.1997
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To prevent a coating film on the surface of a wafer from varying in thickness throughout the surface of the wafer in a thermal treatment and solvent comprised in a coating film vaporized through a thermal treatment from leaking out of a thermal treatment device. SOLUTION: A thermal treatment device 1 is composed of a hermetically closed chamber 12 where a wafer 40 on which a coating film is formed is housed, a heating means 13 which heats the inside of the hermetically closed chamber 12, a hood 14 which surrounds the hermetically closed chamber 12, and an exhausting means 15 which exhausts the inside of the hood 14.
Bibliography:Application Number: JP19950245624