SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To realize a cooling structure of a semiconductor device or especially a multi-chip module comparatively small in heat release value, wherein the device can be lessened in weight as a whole, and impurities are restrained from penetrating into the device. SOLUTION: A resin packa...

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Bibliographic Details
Main Authors TSUCHIYA MASATO, MURATAKE KIYOSHI
Format Patent
LanguageEnglish
Published 28.03.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To realize a cooling structure of a semiconductor device or especially a multi-chip module comparatively small in heat release value, wherein the device can be lessened in weight as a whole, and impurities are restrained from penetrating into the device. SOLUTION: A resin package 2 is so molded as to seal up the board 3 with resin in such a manner that the one end faces of heat conductive nuts 22 (or screws 25) are bonded to the required spots of a board 3 mounted with chip parts 4-1 and 4-2 which form a circuit device, and the other end faces of the nuts 22 (or parts of screws 25) are exposed to the outside, and a heat dissipating fin 24 is mounted on the nuts (or screws) with screws (or nuts) which fit in the nuts (or screws).
Bibliography:Application Number: JP19950231173