MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME USED THEREFOR

• Main Authors: SOBA TAKUMI, SAKAMOTO TOMOO
• Format: Patent
• Language: English
• Published: 10.01.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: To prevent the leakage of resin without using a dam bar by putting a waste punched off from the section between adjacent outer leads between the outer leads as a leakage preventing member. CONSTITUTION: A leakage preventing member 10 which prevents the leakage of resin to the space between outer leads 8 and 8 at the time of molding sealing resin is put between the outer leads 8 and 8. The leakage preventing member 10 is composed of a waste produced when the section between the adjacent outer leads 8 is punched off for forming the outer leads 8 at the time forming a lead frame 1 by performing press work and put between the leads 8 by pushing back the member 10 into the space between the leads 8. A positioning projection 11 is formed on the outside end section of the member 10 so that the projection 11 can be engaged with the positioning recessed section 12 of each lead 8. When the projection 11 is engaged with the section 12, the inward shifting of the member 10 is prevented.