CIRCUIT BOARD MOUNTING ELECTRONIC DEVICE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To protect electronic devices and a board against damage by making a recess or protrusion in the board on the periphery of joint of an electronic device, arranging a brazing material at the recess or protrusion and jointing the electronic device to the board through the brazing...

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Bibliographic Details
Main Authors KUBO MASAO, NAKAMURA YOSHIMITSU, UCHIDA YUICHI, KAMATA SAKUO
Format Patent
LanguageEnglish
Published 07.03.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To protect electronic devices and a board against damage by making a recess or protrusion in the board on the periphery of joint of an electronic device, arranging a brazing material at the recess or protrusion and jointing the electronic device to the board through the brazing material. SOLUTION: A circuit pattern 13 is formed on the upper surface of a board 1 and a pair of recesses 2 are made through the circuit pattern 13 and then a brazing material 4 is set in each recess 2. A plug-in part 15 is projected from the lower surface of the brazing material 4 which is secured to the board 1 and connected with the circuit pattern 13 when the part 15 is plugged into the recess 2 and secured in place. An electronic device 5 is jointed onto the brazing material 4 and an electrode part 14 is provided over the entire circumference thereof while being jointed to the brazing material 4. This structure protects the electronic device 5 and the board 1 against damage.
Bibliography:Application Number: JP19950219320