SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING IT

PROBLEM TO BE SOLVED: To enable manufacturing with high productivity by forming bumps in one step. SOLUTION: Bumps 1 are formed on a semiconductor wafer 4, resin 3 is prepared with the thickness of 1/5 to 1/2 of the height of the bumps 1 on the bump forming surface of a semiconductor wafer 1 and aft...

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Bibliographic Details
Main Author KUZUHARA KAZUNARI
Format Patent
LanguageEnglish
Published 07.03.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To enable manufacturing with high productivity by forming bumps in one step. SOLUTION: Bumps 1 are formed on a semiconductor wafer 4, resin 3 is prepared with the thickness of 1/5 to 1/2 of the height of the bumps 1 on the bump forming surface of a semiconductor wafer 1 and after curing the resin 3, the semiconductor wafer 1 is diced to chips 2. The bumps 1 are not buried in the resin 3 and the manufacturing of the bumps 2 does not require two steps.
Bibliography:Application Number: JP19950219111