HEAT EXCHANGER

PROBLEM TO BE SOLVED: To prevent a heat exchanging speed from being decreased even after a heat exchanger is operated for a long period of time by a method wherein a thermal medium inlet and a thermal medium outlet are arranged at a forward end and a rearward end of a housing for storing some heat e...

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Bibliographic Details
Main Authors SEI MIKIO, KUDO HITOSHI, SUGAWARA AKIRA, TSUBAKI KENJI, YABUNOUCHI NOBUAKI
Format Patent
LanguageEnglish
Published 07.03.1997
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To prevent a heat exchanging speed from being decreased even after a heat exchanger is operated for a long period of time by a method wherein a thermal medium inlet and a thermal medium outlet are arranged at a forward end and a rearward end of a housing for storing some heat exchanging elements in which inter-particle portions of organic system heat accumulating material carried on low crystalline polyolefin having a specified value of crystalline degree are applied as thermal medium flow passages. SOLUTION: Within a housing 5 are stored some heat exchanging elements 4 in which inter-particle portions of thermal accumulation member 1 acting as assembly 2 of particles are applied as thermal medium flow passages 3. The thermal accumulation member 1 comprises low crystalline polyolefin with a degree of crystallization lower than 40% and organic system thermal accumulating material of which phases are transferred between solid and liquid carried by the low crystalline polyolefin as its composing raw material. Then, a thermal medium inlet 6 is arranged at a front end surface of the housing 5 and a thermal mediums outlet 7 is arranged at a rear end surface of it, and a plurality of storing chambers 8 storing some heat exchanging elements 4 are arranged in the housing 5. In addition, a thermal medium flowing passage 12 is arranged below the storing chamber 8 and a thermal medium discharging passage 13 is arranged above the storing chamber 8, the upper and lower storing chambers 8 are partitioned by a spacer plate 14 and then the thermal medium is flowed in or discharged out of some through-pass holes 10 of an upper inner wall 9b and a lower inner wall 9b.
Bibliography:Application Number: JP19950216920