APPLICATION FILM FOR THERMAL TRANSFER, THERMAL TRANSFER MATERIAL USING THE SAME, AND THERMAL TRANSFER MARKING METHOD

PROBLEM TO BE SOLVED: To transfer a mark simply and surely at a normal position without dislocation and to improve the appearance by preventing the migration of the mark of an adhesive layer to the surface of a design. SOLUTION: The ultraviolet curing pressure sensitive adhesive layer 2 of an applic...

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Bibliographic Details
Main Authors HAYASHI TORU, SHIMAZAKI YUKIO
Format Patent
LanguageEnglish
Published 04.03.1997
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To transfer a mark simply and surely at a normal position without dislocation and to improve the appearance by preventing the migration of the mark of an adhesive layer to the surface of a design. SOLUTION: The ultraviolet curing pressure sensitive adhesive layer 2 of an application film A and a foundation 3 are laminated. A thermal transfer marking sheet is cut so that the inverted form of a mark to be obtained remains seen from the side of a hotmelt adhesive to obtain a thermal transfer material C in which a mark material M having the inverted form of the mark to be obtained is formed on the application film A. The mark material M of the thermal transfer material C is contacted with an article D and heat-pressed to bond the mark material M integrally to the article D. The application film A is peeled off, and the mark of the mark material M is transferred thermally to the article D.
Bibliography:Application Number: JP19960143998