APPLICATION FILM FOR THERMAL TRANSFER, THERMAL TRANSFER MATERIAL USING THE SAME, AND THERMAL TRANSFER MARKING METHOD
PROBLEM TO BE SOLVED: To transfer a mark simply and surely at a normal position without dislocation and to improve the appearance by preventing the migration of the mark of an adhesive layer to the surface of a design. SOLUTION: The ultraviolet curing pressure sensitive adhesive layer 2 of an applic...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
04.03.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To transfer a mark simply and surely at a normal position without dislocation and to improve the appearance by preventing the migration of the mark of an adhesive layer to the surface of a design. SOLUTION: The ultraviolet curing pressure sensitive adhesive layer 2 of an application film A and a foundation 3 are laminated. A thermal transfer marking sheet is cut so that the inverted form of a mark to be obtained remains seen from the side of a hotmelt adhesive to obtain a thermal transfer material C in which a mark material M having the inverted form of the mark to be obtained is formed on the application film A. The mark material M of the thermal transfer material C is contacted with an article D and heat-pressed to bond the mark material M integrally to the article D. The application film A is peeled off, and the mark of the mark material M is transferred thermally to the article D. |
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Bibliography: | Application Number: JP19960143998 |