SURFACE MOUNT ELECTRONIC PART AND MANUFACTURE THEREOF

• Main Authors: SHIBATA KAZUTAKA, SHOJI YASUNOBU
• Format: Patent
• Language: English
• Published: 14.02.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

PROBLEM TO BE SOLVED: To provide a surface mount electronic part on which the wettability of the solder on the edge face of a non-soldered external lead can be improved, and the board mounting strength by reflow soldering can be further improved. SOLUTION: A resin package, in which an element and a plurality of inner leads, etc., which are electrically conducted to the element, are enveloped and a plurality of external leads 5, which are continuously extended to each inner lead from the side face of the above-mentioned resin package, are provided in the surface mount electronic part on which a horizontal part 6 is formed on the tip part of each external lead. The edge face 7 of the horizontal part 6 of the external lead 5 is connected to the bottom face of the horizontal part by a round part. Preferably, a plurality of streaks 9, which are extending in the vertical direction, are formed on the edge face 7 of the horizontal part.