PERFORATED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To obtain a plurality of printed wiring boards coupled through perforations in which protrusion is prevented from being formed on the side face of printed wiring board after the individual printed wiring board is cut off along the perforation. SOLUTION: In a plurality of printe...

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Bibliographic Details
Main Author WAKABAYASHI YUKO
Format Patent
LanguageEnglish
Published 07.02.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To obtain a plurality of printed wiring boards coupled through perforations in which protrusion is prevented from being formed on the side face of printed wiring board after the individual printed wiring board is cut off along the perforation. SOLUTION: In a plurality of printed wiring boards 3-1, 3-2, 3-3, 3-4 coupled through perforations, the perforations are formed such that a protrusion at the joint 3 of perforation, being formed when the individual printed wiring board 3-1, 3-2, 3-3, 3-4 is cut off along the perforation, is located on the inside of maximum dimension part x1, x2, y1, y2 of printed wiring board on one side of perforation when viewed from the printed wiring board 3-1, 3-2, 3-3, 3-4.
Bibliography:Application Number: JP19950184103