PERFORATED PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To obtain a plurality of printed wiring boards coupled through perforations in which protrusion is prevented from being formed on the side face of printed wiring board after the individual printed wiring board is cut off along the perforation. SOLUTION: In a plurality of printe...
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Main Author | |
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Format | Patent |
Language | English |
Published |
07.02.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To obtain a plurality of printed wiring boards coupled through perforations in which protrusion is prevented from being formed on the side face of printed wiring board after the individual printed wiring board is cut off along the perforation. SOLUTION: In a plurality of printed wiring boards 3-1, 3-2, 3-3, 3-4 coupled through perforations, the perforations are formed such that a protrusion at the joint 3 of perforation, being formed when the individual printed wiring board 3-1, 3-2, 3-3, 3-4 is cut off along the perforation, is located on the inside of maximum dimension part x1, x2, y1, y2 of printed wiring board on one side of perforation when viewed from the printed wiring board 3-1, 3-2, 3-3, 3-4. |
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Bibliography: | Application Number: JP19950184103 |