TRANSDUCER SUPPORTING MECHANISM

PROBLEM TO BE SOLVED: To make the mass production of head supporting mechanisms possible and to improve the cost by etching an Si substrate by crystal anisotropy, thereby forming a slope. SOLUTION: This transducer supporting mechanism consists of the head of a magnetic disk device and a suspension 1...

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Main Authors IMAI SATOMITSU, HARADA TAKESHI, HIGASHIYA TERUYOSHI, HORINO MASAYA, SATOU KAZUYASU, AKASHI TERUHISA, KATO YUKIO, TOKUYAMA MIKIO
Format Patent
LanguageEnglish
Published 07.02.1997
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To make the mass production of head supporting mechanisms possible and to improve the cost by etching an Si substrate by crystal anisotropy, thereby forming a slope. SOLUTION: This transducer supporting mechanism consists of the head of a magnetic disk device and a suspension 1 consisting of Si. The slope 7 is formed on the Si suspension 1 by wet etching utilizing the crystal anisotropy and signal lines 6 are formed by sputtering or vapor deposition, etc., using a shadow mask on the slope 7. As a result, the execution of the electrical connection of the Si suspension 1 and the transducer 3 by batch working is made possible. The mass production of the transducer supporting mechanisms of heads, sensors, etc., and the cost reduction are made possible.
Bibliography:Application Number: JP19950175844