FORMING METHOD OF LOW SPECIFIC DIELECTRIC CONSTANT POLYMER FILM, FORMING METHOD OF INTERLAYER INSULATING FILM AND LOW SPECIFIC DIELECTRIC CONSTANT POLYMER FILM FORMING APPARATUS

• Main Authors: SATO MASATOSHI, UKISHIMA YOSHIYUKI
• Format: Patent
• Language: English
• Published: 16.12.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To obtain a low specific dielectric constant film which has high heat- resistance and stable characteristics by a simple process. SOLUTION: Raw monomer which has substituents such as methyl-groups, methoxy-groups, t-butyl groups, etc., which have large staeric hindrance in side chains is used when the raw monomer is vaporized in a vacuum and deposited and polymerized on a substrate to form a polymer film or a polyimide film. After a deposited film is formed in a deposited polymerized film forming chamber 1, an ultraviolet radiation is applied to the deposited film in an ultraviolet radiation chamber 1 for cross-linking reaction or the deposited film is heated and polymerized in a heating chamber 3 without the ultraviolet radiation application. With this constitution, a low specific dielectric constant interlayer insulating film which has high-heat-resistance and does not show change with time can be obtained.