APPARATUS FOR VISUAL INSPECTION OF CYLINDRICAL ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To conduct a visual examination at high speed and precisely by which the outward appearance of a cylindrical electronic component such as a diode or the like can be inspected. SOLUTION: A mold-side-face inspection part 2, a stamp inspection part 5, a mold-edge and lead inspecti...

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Bibliographic Details
Main Author FUKUDA KAZUHIKO
Format Patent
LanguageEnglish
Published 16.12.1997
Edition6
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To conduct a visual examination at high speed and precisely by which the outward appearance of a cylindrical electronic component such as a diode or the like can be inspected. SOLUTION: A mold-side-face inspection part 2, a stamp inspection part 5, a mold-edge and lead inspection part 6, a taping inspection part 7 and the like are installed, respective parts at a cylindrical electronic component are inspected in a time-series manner, and a defect can be inspected without any omissions. Especially the component is turned so as to be imaged a plurality of numbers of times by the mold-edge and lead inspection part 6, an illumination way is contrived, and the component is inspected without any omissions.
Bibliography:Application Number: JP19960142450