APPARATUS FOR VISUAL INSPECTION OF CYLINDRICAL ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To conduct a visual examination at high speed and precisely by which the outward appearance of a cylindrical electronic component such as a diode or the like can be inspected. SOLUTION: A mold-side-face inspection part 2, a stamp inspection part 5, a mold-edge and lead inspecti...

Full description

Saved in:
Bibliographic Details
Main Author FUKUDA KAZUHIKO
Format Patent
LanguageEnglish
Published 16.12.1997
Edition6
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To conduct a visual examination at high speed and precisely by which the outward appearance of a cylindrical electronic component such as a diode or the like can be inspected. SOLUTION: A mold-side-face inspection part 2, a stamp inspection part 5, a mold-edge and lead inspection part 6, a taping inspection part 7 and the like are installed, respective parts at a cylindrical electronic component are inspected in a time-series manner, and a defect can be inspected without any omissions. Especially the component is turned so as to be imaged a plurality of numbers of times by the mold-edge and lead inspection part 6, an illumination way is contrived, and the component is inspected without any omissions.
Bibliography:Application Number: JP19960142450