PRODUCTION OF RESIST PATTERN AND FORMING METAL MOLD

PROBLEM TO BE SOLVED: To manufacture a resist pattern and a forming metal mold having desired shapes (fine and complex shapes in particular) with high accuracy. SOLUTION: A resist layer 2 is formed on a substrate 1 and then pattern- shaped resist layers 2' having larger thickness than a designe...

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Bibliographic Details
Main Author OSHINO TETSUYA
Format Patent
LanguageEnglish
Published 02.12.1997
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
CINEMATOGRAPHY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CORRECTION OF TYPOGRAPHICAL ERRORS
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LINING MACHINES
MATERIALS THEREFOR
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTING
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:PROBLEM TO BE SOLVED: To manufacture a resist pattern and a forming metal mold having desired shapes (fine and complex shapes in particular) with high accuracy. SOLUTION: A resist layer 2 is formed on a substrate 1 and then pattern- shaped resist layers 2' having larger thickness than a designed value are formed by executing photolithography and dryetching or wetetching to the resist layer 2. Then the pattern-shaped resist layers 2' are subjected to a machining and thickness thereof is made to the designed value or to a little larger value than the designed value. Further burrs 3 of the resist generated at the time of machining are removed from pattern-shaped resist layers 2a to form pattern-shaped resist layers 2b having a designed shape.
Bibliography:Application Number: JP19960127418