ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide an electronic part having a mounting plate for surface mounting coupled to a body of the electronic part having a plurality of leads led out from its one end, which can facilitate lead-out of the leads to an outer surface of a mounting plate and can ensure solder con...

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Bibliographic Details
Main Authors NAKAGAWA HIROYUKI, OKUBO KOZABURO, NONOGUCHI TAKESHI, NISHINO SEIICHI, YOKOYAMA TAKASHI
Format Patent
LanguageEnglish
Published 04.11.1997
Edition6
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Summary:PROBLEM TO BE SOLVED: To provide an electronic part having a mounting plate for surface mounting coupled to a body of the electronic part having a plurality of leads led out from its one end, which can facilitate lead-out of the leads to an outer surface of a mounting plate and can ensure solder connection of the leads to wiring substrate conductors of metallic terminals provided on the outside surface of the mounting plate. SOLUTION: A mounting plate 8 is formed therein with parallel slits 9 and 9 extended from its one side edge 8a, leads 3 and 3 passed through the slits and located at the deepest positions, are connected to metallic terminals 10 and 10 provided on an outer side surface of the mounting plate, the mounting plate is provided at its 4 corners with projections 13, 13, 13 and 13 on its outer side surface, so that, at the time of mounting the electronic part, a suitable gap takes place between the wiring substrate conductors and metallic terminals 10 and 10.
Bibliography:Application Number: JP19960122585