METHOD FOR CUTTING PLATE-LIKE WORKPIECE

PROBLEM TO BE SOLVED: To prevent the occurrence of stains and soils on a workpiece surface caused by ground chips produced during workpiece grinding. SOLUTION: For cutting a plate-like workpiece 4, grinding is performed by pressing the peripheral end part of a grinding wheel 12 to the surface of the...

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Bibliographic Details
Main Authors INAGAKI TOSHIMITSU, TAKAHASHI AKIO, MATSUURA KAZUHIRO
Format Patent
LanguageEnglish
Published 04.11.1997
Edition6
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To prevent the occurrence of stains and soils on a workpiece surface caused by ground chips produced during workpiece grinding. SOLUTION: For cutting a plate-like workpiece 4, grinding is performed by pressing the peripheral end part of a grinding wheel 12 to the surface of the workpiece 4 while the grinding wheel 12 of a cutter 8 is rotary-driven. For this grinding, water is injected from the water injection nozzle 16 of the cutter 8 and ground chips in a grinding part are eliminated, a water spraying nozzle 18 is provided in the periphery of the workpiece 4, water is sprayed from this water spraying nozzle 18 to the surface of the workpiece 4 and thereby the entire surface of the workpiece 4 is covered with a fluid film 20 containing clean water. Thus, dirty water containing ground chips is surely discharged from the surface of the workpiece 4, and when the surface of the workpiece is dry, clean water is evaporated and thereby the occurrence of stains or soils is prevented.
Bibliography:Application Number: JP19960097049