PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To reduce the noise, allow electronic parts to be mounted at a high mounting density and improve the productivity. SOLUTION: A laminate board 2 is drilled to form holes 4 and electroless- plated with Cu to form an outer layer circuit and deposit conductors 5a, 5b on the inner w...

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Bibliographic Details
Main Authors YOKOYAMA HIROYOSHI, ITARU YASUO
Format Patent
LanguageEnglish
Published 21.10.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To reduce the noise, allow electronic parts to be mounted at a high mounting density and improve the productivity. SOLUTION: A laminate board 2 is drilled to form holes 4 and electroless- plated with Cu to form an outer layer circuit and deposit conductors 5a, 5b on the inner walls of the holes 4, thereby forming through-holes 5. Before forming an insulation layer 8 covering one end opening of each hole 4 with an insulation resin ink, the opposite end opening of each hole 4 to this layer 8 is closed with an adhesive film 7.
Bibliography:Application Number: JP19960082517