ALKALI-DEVELOPABLE RESIN COMPOSITION AND CURED FILM MADE THEREFROM

• Main Authors: TERAMOTO TAKEO, WATABE KAZUHIRO, KAWASATO HIRONOBU, FUJISHIRO KOICHI
• Format: Patent
• Language: English
• Published: 16.09.1997
• Edition: 6
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To obtain an alkali-developable resin composition desirably used in the preparation of good nondefective coating films, color filters, etc., by reducing the formation of a gel to a specified degree in reacting a fluorenehydroxypropyl acrylate resin with a polybasic carboxylic acid or its anhydride. SOLUTION: This composition is a reaction product obtained by reacting an acrylate resin represented by the formula (wherein R is hydrogen or methyl; and (n) is an integer of 0-20) and having a content of unreacted epoxy groups of 10,000 or above (in terms of an epoxy equivalent) with a polybasic carboxylic acid or its anhydride. The reaction product should satisfy the following requirements: the number of 0.5μm or larger particles is below 10,000 when a 30wt.% solution of the product is applied to a 5-inch silicon wafer.