PRINTED WIRING BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To reduce the poor operation or poor connection of an apparatus incorporated with printed interconnection boards. SOLUTION: A printed wiring boards 8 have such a product size that many boards 8 can be cut out from a multi-side a laminated board 2 for multi-board patterns along...

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Bibliographic Details
Main Authors YOKOYAMA HIROYOSHI, OWADA MASASHI
Format Patent
LanguageEnglish
Published 05.09.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHECKING-DEVICES
COIN-FREED OR LIKE APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To reduce the poor operation or poor connection of an apparatus incorporated with printed interconnection boards. SOLUTION: A printed wiring boards 8 have such a product size that many boards 8 can be cut out from a multi-side a laminated board 2 for multi-board patterns along slits 6 by blank punching. Bridges 7 are formed on the slit 6 and the inner wall of the slit 6 is plated before cutting the boards 8 from the laminated board 2.
Bibliography:Application Number: JP19960041173