SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding) process and MLB(middle lead bonding) process making use of TAB(tape automated bonding). SOLUTION: This manufacturing method has a first proc...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
05.09.1997
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding) process and MLB(middle lead bonding) process making use of TAB(tape automated bonding). SOLUTION: This manufacturing method has a first process to join the connection electrode of a semiconductor element 2 to the inner lead of a TAB tape 3, and a second process to join the outer lead of the said TAB tape to the inner lead of a frame. Then, the lead 3A of the TAB tape 3 is constituted of an aluminum material in advance, and the joining during the said first and second processes is performed by giving vertical ultrasonics and load to the semiconductor element 2. |
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| AbstractList | PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding) process and MLB(middle lead bonding) process making use of TAB(tape automated bonding). SOLUTION: This manufacturing method has a first process to join the connection electrode of a semiconductor element 2 to the inner lead of a TAB tape 3, and a second process to join the outer lead of the said TAB tape to the inner lead of a frame. Then, the lead 3A of the TAB tape 3 is constituted of an aluminum material in advance, and the joining during the said first and second processes is performed by giving vertical ultrasonics and load to the semiconductor element 2. |
| Author | NOMURA TAKEO |
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| Edition | 6 |
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| Notes | Application Number: JP19960040015 |
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| PublicationDate | 19970905 |
| PublicationDateYYYYMMDD | 1997-09-05 |
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| PublicationDecade | 1990 |
| PublicationYear | 1997 |
| RelatedCompanies | IWATE TOSHIBA ELECTRON KK TOSHIBA CORP |
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| Snippet | PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding)... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
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