SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding) process and MLB(middle lead bonding) process making use of TAB(tape automated bonding). SOLUTION: This manufacturing method has a first proc...

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Bibliographic Details
Main Author NOMURA TAKEO
Format Patent
LanguageEnglish
Published 05.09.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which can prevent the bonding dislocation trouble in ILB(inner lead bonding) process and MLB(middle lead bonding) process making use of TAB(tape automated bonding). SOLUTION: This manufacturing method has a first process to join the connection electrode of a semiconductor element 2 to the inner lead of a TAB tape 3, and a second process to join the outer lead of the said TAB tape to the inner lead of a frame. Then, the lead 3A of the TAB tape 3 is constituted of an aluminum material in advance, and the joining during the said first and second processes is performed by giving vertical ultrasonics and load to the semiconductor element 2.
Bibliography:Application Number: JP19960040015