MULTILAYERED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multilayered wiring board which effectively prevents generation of disconnection of wiring conductor or through hole conductor is effectively prevented and can ensure electrical connection of each electronic component mounted on an insulating substratum. SOLUTION:...

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Bibliographic Details
Main Authors AIHARA KENICHI, OKUNOSONO TAKASHI
Format Patent
LanguageEnglish
Published 21.01.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a multilayered wiring board which effectively prevents generation of disconnection of wiring conductor or through hole conductor is effectively prevented and can ensure electrical connection of each electronic component mounted on an insulating substratum. SOLUTION: In the title multilayered wiring board, a plurality of wiring conductors 2 are arranged as multilayered structure in an insulating substratum 1 composed of ceramic sintered body, and each of the wiring conductor 2 is connected via through hole conductors 3. When the length of the wiring conductor 2 is L1 , the sectional area is S2 , the resistivity is σ1 , the length of the through hole conductor 3 is L2 , the sectional area is S2 , and the resistivity of the through hole is σ2 , the relation σ1 .L1 /S1 >=σ2 .L2 /S2 is satisfied.
Bibliography:Application Number: JP19950171805