BONDING DEVICE, BONDING TOOL OPERATION CONTROLLER AND LOAD CONTROLLING METHOD THEREFOR

• Main Authors: KASHIMA NORIYASU, SUEMATSU MUTSUMI, KUBO TETSUYA
• Format: Patent
• Language: English
• Published: 21.01.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: To accurately control the position and applied pressure of a bonding tool with high response by a simple structure. CONSTITUTION: When a servo motor 23 is rotated in a direction of an arrow 31, the end of a pressurizing arm 13 is moved down, and an inner lead bonding tool 8 is moved down vi...