BONDING DEVICE, BONDING TOOL OPERATION CONTROLLER AND LOAD CONTROLLING METHOD THEREFOR

PURPOSE: To accurately control the position and applied pressure of a bonding tool with high response by a simple structure. CONSTITUTION: When a servo motor 23 is rotated in a direction of an arrow 31, the end of a pressurizing arm 13 is moved down, and an inner lead bonding tool 8 is moved down vi...

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Bibliographic Details
Main Authors KASHIMA NORIYASU, SUEMATSU MUTSUMI, KUBO TETSUYA
Format Patent
LanguageEnglish
Published 21.01.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To accurately control the position and applied pressure of a bonding tool with high response by a simple structure. CONSTITUTION: When a servo motor 23 is rotated in a direction of an arrow 31, the end of a pressurizing arm 13 is moved down, and an inner lead bonding tool 8 is moved down via a bonding member 17. The fact that the tool 8 is arrived at the bonding surface is detected by a position detector 28, further the load is detected by a strain detector 29, and fed back to control means 9. Then, the difference between the load detected value and the load target value is taken by the means 9, and a current flows to the motor 23 according to a predetermined pressurizing profile. Predetermined arbitrary optimum applied pressure is applied from the motor 23 directly to the tool 8.
Bibliography:Application Number: JP19930139712