PRODUCTION OF PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board easily and inexpensively while shortening the production process. SOLUTION: A UV-curing insulating resin layer 2 is formed on an insulating board 1 and cured by irradiating with UV-rays 4 except the part for forming a con...

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Bibliographic Details
Main Author SEKIGUCHI KUNIAKI
Format Patent
LanguageEnglish
Published 15.07.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board easily and inexpensively while shortening the production process. SOLUTION: A UV-curing insulating resin layer 2 is formed on an insulating board 1 and cured by irradiating with UV-rays 4 except the part for forming a conductor 8. Subsequently, only the part of insulating resin layer 2 for forming a conductor 8 is roughened and a plating catalyst 5 is bonded to the roughened part. Finally, a conductor 8 is formed by electroless plating.
Bibliography:Application Number: JP19950353143