VISCOUS MATERIAL COATING METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To avoid failing in carrying a semiconductor chip even with the use of a high-viscosity material laid in a vessel by processing the material to form recesses and protrusions higher than the recesses. SOLUTION: A viscous material 16 laid in a vessel 15 is processed to form reces...

Full description

Saved in:
Bibliographic Details
Main Author ARIKADO KAZUO
Format Patent
LanguageEnglish
Published 15.07.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To avoid failing in carrying a semiconductor chip even with the use of a high-viscosity material laid in a vessel by processing the material to form recesses and protrusions higher than the recesses. SOLUTION: A viscous material 16 laid in a vessel 15 is processed to form recesses 16a and protrusions 16b higher than the recesses, a nozzle 10 is lowered to touch the lower face of a semiconductor chip 13 to the material 16 such that the lower face of the chip touches only the protrusions 16b, without touching the recesses 16a. Since the entire lower face of the chip 13 does not touch the material 16 but only a part thereof, the adhesive force of the material 16 exerting on the chip 13 is reduced, compared with that in the case of the entire lover face touched with the material when the nozzle 10 is lifted thereafter. Thus, the carrying failure of the chip can be suppressed.
Bibliography:Application Number: JP19960000551