MOUNTER AND MOUNTING METHOD

PROBLEM TO BE SOLVED: To protect a semiconductor device against electrostatic breakdown due to charging at the time of stripping an adhesive tape therefrom and to relax the regulation of adhesion under taped stated. SOLUTION: The mounter for stripping an adhesive tape 2 from a semiconductor device 1...

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Bibliographic Details
Main Author SUGAWA KOJI
Format Patent
LanguageEnglish
Published 17.01.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:PROBLEM TO BE SOLVED: To protect a semiconductor device against electrostatic breakdown due to charging at the time of stripping an adhesive tape therefrom and to relax the regulation of adhesion under taped stated. SOLUTION: The mounter for stripping an adhesive tape 2 from a semiconductor device 1 and mounting the semiconductor device 1 on a board comprises means 13 for heating the bonded part of semiconductor device 1 and adhesive tape 2 when the adhesive tape 2 is stripped from the semiconductor device 1.
Bibliography:Application Number: JP19950167414