PRODUCTION OF MULTILAYER PRINTED WIRING BOARD

PURPOSE: To lower the reflectance of a microsurface by subjecting the surface of a copper layer to blackening and a subsequent microsurface treatment using a phosphoric acid based treating liquid and drying under presence of oxygen prior to formation of a photosensitive resist layer. CONSTITUTION: A...

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Bibliographic Details
Main Authors YOSHIDA RISABURO, OOTA AKITSU, NAKAMURA KIYOTOMO
Format Patent
LanguageEnglish
Published 17.01.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: To lower the reflectance of a microsurface by subjecting the surface of a copper layer to blackening and a subsequent microsurface treatment using a phosphoric acid based treating liquid and drying under presence of oxygen prior to formation of a photosensitive resist layer. CONSTITUTION: A copper layer 2 of printed wiring board material is subjected to blackening using an alkaline oxidizing liquid followed by microsurface treatment using an acid treating liquid of phosphoric acid based treating liquid or organic acid based treating liquid. Consequently, the rough surface caused by blackening is converted through dissolution etching into microirregular surface. Subsequently, it is washed with water and dried under presence of oxygen thus. Dark brown color appears on the surface of the copper layer 2 to enrich oxygen and to lower the reflectance on the surface of the copper layer 2. Furthermore, the microirreularities enhances adhesion to a photosensitive resist layer 3, e.g. a photosensitive film.
Bibliography:Application Number: JP19950188059